January 5, 2024
Lewis-Burke Associates, LLC provides campus with a weekly Washington Update every Friday. In this report:
- Funding Opportunity: NSF CISE Announces Program Enabling Access to the Semiconductor Chip Ecosystem for Design, Fabrication, and Training (Chip Design Hub)
- Engagement Opportunity: DARPA Announces 2024 Discover DSO Day (D3)
- Funding Opportunity: NSF Releases New Solicitation Under FuSe Initiative
- Funding Opportunity: NSF Releases Collaborations in Artificial Intelligence and Geosciences (CAIG) Solicitation