Lewis-Burke has provided campus with a report about a new $33.5 million funding opportunity from the National Semiconductor Technology Center (NSTC), the Scalable Memory Architecture Program (SMAP).
SMAP aims to develop new architectural solutions that leverage new memory technologies and advanced packaging techniques to create the “data, tools, and technology assessment capabilities needed to optimize performance, reduce latency, and improve energy efficiency in high computing data center systems and energy-constrained edge systems.” SMAP will fund research teams in two focus areas: data center compute systems, and edge compute systems. Within each focus area, the teams will cover three technology areas: new memory technologies, advanced packaging technologies, and programming models.
The full funding opportunity will be issued on April 14, with a proposers’ day to be held in Columbus, OH on April 29. Concept papers are due by May 6, with full proposals due June 17, 2025.