January 31, 2024
Lewis-Burke Associates has provided campus with a report about the National Institute of Standards and Technology (NIST) CHIPS Program Office's two new Notices of Intent (NOI) for future CHIPS R&D funding opportunities:
- CHIPS Manufacturing USA Institute:
- At least $200 million will be invested in one new CHIPS Manufacturing USA Institute focused on digital twin technology to advance semiconductor and advanced packaging manufacturing.
- The full NOFO is expected to be issued in the second quarter of 2024.
- NIST will host a briefing webinar on Friday, February 2, 2024, at 3PM ET; participants must register in advance here.
- NIST will also host a virtual Industry Day on Monday, February 12, 2024, at 12:30PM ET. Participants must register in advance here.
- National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development:
- NIST will announce new R&D opportunities with total funding of approximately $300 million to “establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.”
- In total, NAPMP will invest $3 billion in programs including “an advanced packaging piloting facility for validating and transitioning new technologies to U.S. manufacturers, workforce training programs to ensure that new processes and tools are capably staffed, and funding for projects.”
- The full NOFO is expected to be released in March 2024.
Lewis-Burke will provide additional information when the full NOFOs are officially released. Note that additional opportunities related to the National Semiconductor Technology Center (NSTC) and the CHIPS Incentives R&D Facilities are also expected early in 2024.